而苹果的统一内存架构 (Unified Memory Architecture) ，让 M 系芯片的 Mac 在端侧推理更大规模的模型时游刃有余。
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而EMIB-T则在硅桥中引入TSV通孔结构，使得信号可垂直穿越桥接芯片本体，实现更高密度、更短路径的垂直互连。
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